4.2.4 In-situ fast curing using heating device<br>Instead of cold curing of the bond interface (curing of the two-component epoxy adhesive<br>under environmental temperature), heating devices can be used.In this way it is possible to<br>reduce curing time, to allow bonding in regions where temperatures are too low to allow coldcuring, to apply the technique in winter time, to work with prepreg FRP types, etc.<br>Different systems for heating can be used, such as electrical heaters, IR (infrared) heating<br>systems and heating blankets.For CFRP the system illustrated in Figure 8 is also possible.<br>This system takes advantage of the electrical conductivity of carbon fibres.It uses a special<br>heating device to pass an electric current through CFRP strips during the strengthening<br>process.The control unit allows the desired curing temperature to be maintained within a<br>narrow range.<br>Controlled fast curing enables not only rapid application of the strengthening technique<br>(e.g. full curing at 70 o<br>C may be achieved in 3 hours) but also increases the glass transition<br>temperature of the adhesive. ...
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